Ara Philipossian: search on Z-Library

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1

Chemical Mechanical Planarization and Old Italian Violins

Philipossian, Ara, Sampurno, Yasa, Peckler, Lauren

Journal:

Year:

2018

Language:

english

File:

PDF, 858 KB

english, 2018

2

Analysis of Frictional Heating of Grooved and Flat CMP Polishing Pads

Borucki, Len, Charns, Leslie, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 872 KB

english, 2004

3

Impact of Novel Pad Groove Designs on Removal Rate and Uniformity of Dielectric and Copper CMP

Doy, Toshiroh K., Seshimo, Kiyoshi, Suzuki, Keisuke, Philipossian, Ara, Kinoshita, Masaki

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 141 KB

english, 2004

4

Retaining Ring Design Impact on CMP Process Stability and Optimization

Smith, Joseph, Wargo, Christopher, Kakireddy, Raghava, Singh, Rakesh, Galpin, Andrew, Philipossian, Ara, Wei, Xiaomin, Bennedine, Karim, Reversat, Claude, Chabourel, Alain

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 441 KB

english, 2010

5

Pad Topography, Contact Area and Hydrodynamic Lubrication in Chemical-Mechanical Polishing

Borucki, Leonard John, Sun, Ting, Zhuang, Yun, Slutz, David, Philipossian, Ara

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 1.35 MB

english, 2009

6

An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization

Sampurno, Yasa, Rice, Adam, Zhuang, Yun, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2011

Language:

english

File:

PDF, 1.67 MB

english, 2011

7

Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP

Mu, Yan, Zhuang, Yun, Sampurno, Yasa, Wei, Xiaomin, Ashizawa, Toranosuke, Morishima, Hiroyuki, Philipossian, Ara

Journal:

Microelectronic Engineering

Year:

2016

Language:

english

File:

PDF, 519 KB

english, 2016

8

Cobalt “Buff Step” Chemical Mechanical Planarization

Stuffle, Calliandra, Han, Ruochen, Sampurno, Yasa, Theng, Siannie, Tseng, Wei-Tsu, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 491 KB

english, 2018

9

Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization

Bahr, Matthew, Sampurno, Yasa, Han, Ruochen, Philipossian, Ara

Journal:

Year:

2017

Language:

english

File:

PDF, 1.94 MB

english, 2017

10

Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements

Vazquez Bengochea, Leticia, Sampurno, Yasa, Kavaljer, Marcus, Johnston, Rob, Philipossian, Ara

Journal:

Year:

2018

Language:

english

File:

PDF, 1.73 MB

english, 2018

11

Effect of Various CVD-Coated Conditioning Disc Designs and Polisher Kinematics on Fluid Flow Characteristics during CMP

Mariscal, Juan Cristobal, Sampurno, Yasa, Slutz, Dave, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2020

Language:

english

File:

PDF, 1.33 MB

english, 2020

12

Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis

Yasa Sampurno, Fransisca Sudargho, Yun Zhuang, Michael Goldstein, Ara Philipossian

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 909 KB

english, 2008

13

Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Yasa Sampurno, Leonard Borucki, Yun Zhuang, Sudhanshu Misra, Karey Holland, Duane Boning, Ara Philipossian

Journal:

Thin Solid Films

Year:

2009

Language:

english

File:

PDF, 723 KB

english, 2009

14

Investigation of high-pressure micro jet technology as an alternative to diamond disc conditioning in ILD CMP

Darren DeNardis, Yoshiyuki Seike, Mineo Takaoka, Keiji Miyachi, Ara Philipossian

Journal:

Year:

2006

Language:

english

File:

PDF, 486 KB

english, 2006

15

Pattern evolution in shallow trench isolation chemical mechanical planarization via real-time shear and down forces spectral analyses

Yasa Sampurno, Fransisca Sudargho, Yun Zhuang, Toranosuke Ashizawa, Hiroyuki Morishima, Ara Philipossian

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 918 KB

english, 2011

16

Impact of Gaseous Additives on Copper CMP in Neutral and Alkaline Solutions Using a CAP System

DeNardis, Darren, Doi, Toshiro, Hiskey, Brent, Ichikawa, Koichiro, Ichikawa, Daizo, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 587 KB

english, 2005

17

Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical Planarization

Philipossian, Ara, Olsen, Scott

Journal:

Japanese Journal of Applied Physics

Year:

2003

Language:

english

File:

PDF, 228 KB

english, 2003

18

Design and Performance of a Controlled Atmosphere Polisher for Silicon Crystal Polishing

Doi, Toshiro, Philipossian, Ara, Ichikawa, Koichiro

Journal:

Electrochemical and Solid-State Letters

Year:

2004

Language:

english

File:

PDF, 376 KB

english, 2004

19

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - Effect of Slurry Application/Injection Methods and Polishing Conditions on Bow Wave Characteristics

Liao, Xiaoyan, Sampurno, Yasa, Zhuang, Yun, Sudargho, Fransisca, Rice, Adam, Philipossian, Ara

Year:

2011

Language:

english

File:

PDF, 100 KB

english, 2011

20

Effect of Slurry Application∕Injection Schemes on Slurry Availability during Chemical Mechanical Planarization (CMP)

Liao, Xiaoyan, Sampurno, Yasa, Zhuang, Yun, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2012

Language:

english

File:

PDF, 192 KB

english, 2012

21

Novel Slurry Injection System for Improved Slurry Flow and Reduced Defects in CMP

Philipossian, Ara, Borucki, Len, Sampurno, Yasa, Zhuang, Yun

Journal:

Solid State Phenomena

Year:

2014

Language:

english

File:

PDF, 349 KB

english, 2014

22

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Effect of Pad Micro-Texture on Frictional Force, Removal Rate, and Wafer Topography during Copper CMP Process

Zhuang, Yun, Liao, Xiaoyan, Borucki, Leonard J., Theng, Siannie, Wei, Xiaomin, Ashizawa, Toranosuke, Philipossian, Ara

Year:

2010

Language:

english

File:

PDF, 834 KB

english, 2010

23

Investigation of Diamond Grit Size and Conditioning Force Effect on CMP Pads Topography

Sun, Ting, Borucki, Leonard, Zhuang, Yun, Philipossian, Ara

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 245 KB

english, 2007

24

Tribological, Thermal, and Wear Characteristics of Poly(phenylene sulfide) and Polyetheretherketone Retaining Rings in Interlayer Dielectric CMP

Wei, Xiaomin, Zhuang, Yun, Sampurno, Yasa, Sudargho, Fransisca, Wargo, Christopher, Borucki, Leonard, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 860 KB

english, 2010

25

Effects of Disk Design and Kinematics of Conditioners on Process Hydrodynamics during Copper CMP

Li, Zhonglin, Lee, Hyosang, Borucki, Len, Rogers, Chris, Kikuma, Ryozo, Rikita, Naoki, Nagasawa, Kenji, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2006

Language:

english

File:

PDF, 893 KB

english, 2006

26

The Activity of HF∕H[sub 2]O Treated Silicon Surfaces in Ambient Air Before and After Gate Oxidation

Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

1992

Language:

english

File:

PDF, 845 KB

english, 1992

27

Analyses of Diamond Disk Substrate Wear and Diamond Microwear in Copper Chemical Mechanical Planarization Process

Meled, Anand, Zhuang, Yun, Wei, Xiaomin, Cheng, Jiang, Sampurno, Yasa Adi, Borucki, Leonard, Moinpour, Mansour, Hooper, Don, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 985 KB

english, 2010

28

Dispersion Number Studies in CMP of Interlayer Dielectric Films

Philipossian, Ara, Mitchell, Erin

Journal:

Journal of The Electrochemical Society

Year:

2003

Language:

english

File:

PDF, 421 KB

english, 2003

29

Development of a Pad Conditioning Process for Interlayer Dielectric CMP Using High-Pressure Micro Jet Technology

Seike, Yoshiyuki, Lee, Hyo-sang, Takaoka, Mineo, Miyachi, Keiji, Amari, Masahiko, Doi, Toshiro, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2006

Language:

english

File:

PDF, 527 KB

english, 2006

30

Novel End-point Detection Method by Monitoring Shear Force Oscillation Frequency for Barrier Metal Polishing in Advanced LSI

Gu, Xun, Nemoto, Takenao, Sampurno, Yasa Adi, Cheng, Jiang, Theng, Sian Nie, Philipossian, Ara, Zhuang, Yun, Teramoto, Akinobu, Ito, Takashi, Sugawa, Shigetoshi, Ohmi, Tadahiro

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 579 KB

english, 2009

31

Experimental Investigation and Numerical Simulation of Pad Stain Formation during Copper CMP

Lee, Hyosang, Zhuang, Yun, Borucki, Leonard, O'Moore, Fergal, Joh, Sooyun, Philipossian, Ara

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 222 KB

english, 2007

32

Optimizing Pad Groove Design and Polishing Kinematics for Reduced Shear Force, Low Force Fluctuation and Optimum Removal Rate Attributes of Copper CMP

Sampurno, Yasa, Philipossian, Ara, Theng, Sian, Nemoto, Takenao, Gu, Xun, Zhuang, Yun, Teramoto, Akinobu, Ohmi, Tadahiro

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 276 KB

english, 2009

33

Effect of Retaining Ring Slot Design on Slurry Film Thickness during CMP

Wei, Xiaomin, Sampurno, Yasa Adi, Zhuang, Yun, Dittler, Roy, Meled, Anand, Cheng, Jiang, Wargo, Christopher, Stankowski, Ralph, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 370 KB

english, 2010

34

Mean Residence Time and Removal Rate Studies in ILD CMP

Philipossian, Ara, Mitchell, Erin

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 400 KB

english, 2004

35

Tribological Characterization of Post-CMP Brush Scrubbbing

Philipossian, Ara, Mustapha, Lateef

Journal:

Solid State Phenomena

Year:

2003

File:

PDF, 431 KB

2003

36

Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization

Liao, Xiaoyan, Zhuang, Yun, Borucki, Leonard J., Cheng, Jiang, Theng, Siannie, Ashizawa, Toranosuke, Philipossian, Ara

Journal:

Japanese Journal of Applied Physics

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

37

Slurry-Induced Pad Wear Rate in Chemical Mechanical Planarization

Meled, Anand, Sampurno, Yasa, Zhuang, Yun, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 107 KB

english, 2010

38

Effect of Slurry Flow Rate on Pad Life during Interlayer Dielectric CMP

Philipossian, Ara, Olsen, Scott

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 66 KB

english, 2004

39

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Effect of Polisher Kinematics in Reducing Average and Variance of Shear Force and Increasing Removal Rate in Copper CMP

Sampurno, Yasa, Philipossian, Ara, Theng, Sian, Nemoto, Takenao, Gu, Xun, Zhuang, Yun, Teramoto, Akinobu, Ohmi, Tadahiro

Year:

2009

Language:

english

File:

PDF, 7.84 MB

english, 2009

40

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - Tribological and Kinetical Analysis of Barrier Metal Polishing for Next Generation Copper Interconnects

Duyos Mateo, Ricardo, Gu, Xun, Nemoto, Takenao, Sugawa, Shigetoshi, Zhuang, Yun, Sampurno, Yasa, Philipossian, Ara, Ohmi, Tadahiro

Year:

2011

Language:

english

File:

PDF, 316 KB

english, 2011

41

CMP Active Diamond Characterization and Conditioner Wear

Borucki, Leonard, Zhuang, Rumin, Zhuang, Yun, Philipossian, Ara, Rikita, Naoki

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 363 KB

english, 2007

42

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - Correlation of Pad Topography, Friction Force and Removal Rate during Tungsten Chemical Mechanical Planarization

Sampurno, Yasa, Rice, Adam, Zhuang, Yun, Philipossian, Ara

Year:

2011

Language:

english

File:

PDF, 299 KB

english, 2011

43

Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate, and Temperature in Copper CMP

Sampurno, Yasa, Borucki, Leonard, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 723 KB

english, 2005

44

Nonideal Flow Behavior Analysis of Atmospheric Thermal Silicon Oxidation Reactors by the Residence Time Distribution Technique

Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

1991

Language:

english

File:

PDF, 1.04 MB

english, 1991

45

A Method for Direct Measurement of Substrate Temperature during Copper CMP

Sampurno, Yasa A., Borucki, Leonard, Zhuang, Yun, Boning, Duane, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 1.11 MB

english, 2005

46

Extending the Flash Heating Removal Rate Model to Various Interlayer Dielectric CMP Consumables

Sorooshian, Jamshid, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 337 KB

english, 2005

47

Modeling Copper CMP Removal Rate Dependency on Wafer Pressure, Velocity, and Dissolved Oxygen Concentration

DeNardis, Darren, Doi, Toshiro, Hiskey, Brent, Ichikawa, Koichiro, Ichikawa, Daizo, Philipossian, Ara

Journal:

Journal of The Electrochemical Society

Year:

2006

Language:

english

File:

PDF, 868 KB

english, 2006

48

Effect of Mechanical Properties of PVA Brush Rollers on Frictional Forces during Post-CMP Scrubbing

Philipossian, Ara, Mustapha, Lateef

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 604 KB

english, 2004

49

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Novel Diamond Disc Diagnostic Method Based on 'Dry' Coefficient of Friction Measurements

Sampurno, Yasa, Sudargho, Fransisca, Meled, Anand, Zhuang, Yun, Philipossian, Ara

Year:

2010

Language:

english

File:

PDF, 326 KB

english, 2010

50

Diamond Disc Diagnostic Method Based on “Dry” Coefficient of Friction Measurements

Meled, Anand, Sampurno, Yasa, Sudargho, Fransisca, Zhuang, Yun, Philipossian, Ara

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 393 KB

english, 2010

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